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| PREPARED BY: DATE: 1 I SPEC. No. ED-97123A APPROVED BY: DATE: ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR Business I I REPRESENTATIVE OPTO-ELECTRONIC DMSION DEVICES DN. dealing name PHOTOCOUPLER MODEL No. PC3H7 1. These Please specification sheets include do not reproduce or cause materials protected anyone to reproduce under them copyright without of Sharp Corporation Sharp's consent. ("Sharp"). 2. When using this product, please observe the absolute maximum ratings and the instructions in these specification sheets, as well as the precautions mentioned below. Sharp assumes for any damage resulting from use of the product which does not comply with the absolute and the instructions included in these specification sheets, and the precautions mentioned (Precautions) (1) This l for use outlined no responsibility maximum ratings below. product is designed l for use in the visual equipment following OA equipment Audio equipment CTerminal) application areas * Home appliances * Measuring : * Telecommunication equipment machines * Computers i * Tooling If the use of the product in the above application (2) or (3). please be sure to observe the precautions (2) Appropriate measures, such as fail-safe design and the safety design of the overall system and equipment, and safety when this product is used for equipment safety in function and precision, such as : * Transportation - Traffic [ * Other (3) signals safety control and safety equipment breakers areas is for equipment listed in paragraphs given in those respective paragraphs. redundant design considering should b-e taken to ensure which demands high reliability train, automobile and security etc.) equipment 1 reliability and (aircraft, * Gas leakage equipment sensor * Rescue Please do not use this product for equipment which and safety in function and precision, such as ; . Space [ * Nuclear equipment power control * Telecommunication equipment require extremely trunk lines) high reliability 1 equipment (for * Medical equipment 1 questions about this product. (4) Please contact and consult with a Sharp sales representative regarding interpretation of the above three paragraphs. and consult with a Sharp sales representative for any if there are any 3. Please contact questions CUSTOMER'S APPROVAL DATE PRESENTED BY T. MatsumLua. Department Engineering Opto-Electronic c-yf I) L \ `h General Manager Dept. ,I1 Devices Div. of DATE BY ELECOM Group SHARP CORPORATION SHARP CORPORATION ED-97123A MODEL No. 1 September 30, 1998 PAG E PC3H7 l/11 1. Application This specification applies to the outline and characteristics Model No. PC3H7. of photocoupler; 2. Outline Refer to the attached drawing No. CY8375K02. 3. Ratings and characteristics Refer to the attached sheet, page 4 to 6. 4. Reliability Refer to the attached sheet, page 7. 5. Incoming inspection Refer to the attached sheet, page 8. 6. Supplement 6.1 Isolation voltage shall be measured in the foIlowing method. (1) Short between anode and cathode on the primary side and between collector and emitter on the secondary side. (2) The dielectric withstand tester with zero-cross circuit shaIl be used. (3) The wave form of applied voltage shall be a sine wave. 6.2 This product is not designed against irradiation. This product is assembled with electrical input and output. This product incorporates non-coherent light emitting diode. 6.3 Packaging specifications Refer to the attached sheet, page 9 to 11. SHARP CORPORATION ED-97123A MODEL No. 1September 30, 199( PAGE PC3H7 6.4 2/11 Collector current (Ic) Delivery rank table (,,G" mark indicates business dealing name of ordered product) 6.5 ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production for this product. Materials for ODS : CFC,, Halon, Carbon 1.1.1 -Trichloroethane tetrachloride. (Methylchloroform) process 6.6 Brominated flame retardants Speclf?c bromlnated flame retardants such as the PBBO, and PBB, are not used in this device at all. 7. Notes Refer to the attached sheet1- 1, 2. SHARP CORPORATION ED-97123A MODEL No. 1 September 30, 199f PAG E PC3H7 2. Outline 3/11 Rankmark Anode mark \ Date code ll Pin Nos. and internal connection diagram Collector Emitter I 4. 0.2 4-to. 2 0 Anode 0 Cathode Epoxy resin Product mass : Approx. *1 ) 2 -digit number shall be marked according to DIN standard. *21 Dimensions in parenthesis are shown for reference. *3) Marking is laser marking UNIT: l/l mm 0.05g Name Drawing No. PC3H7 Outline Dimensions (Business dealing name : PC3H71 CY8375K02 SHARP CORPORATION ED-97 MODEL 123A No. 1 September 30, 199( PAG E PC3H7 4/11 3. Ratings and characteristics 3.1 Absolute maximum ratings Ta=25% Emitter-collector output Collector current *l *l voltage VEC0 Ic PC Ptot Topr Tstg vi.50 Tsol 6 50 150 170 -30 to +lOO -40 to +125 2.5 260 V mA mW mW "C "C kVrms "C Collector power dissipation Total power dissipation Operating temperature Storage temperature *3 Isolation voltage l 4 Soldering temperature *l The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1 to 4. ps, Duty ratio : 0.001 (Refer to Fig. 5) *2 Pulse widths100 *3 AC for 1 min. 40 to 6O%RH, f=GOHz *4 ForlOs SHARP CORPORATlON ED-97123A MODEL No. 1 September 30. 1998 PAGE PC3H7 3.2 Electra-optical characteristics Ta=25C 5/11 output Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current Collector-emitter saturation voltage BvECO IF=0 I,=10 /LA, I,=0 6 V Ic V CEbat) I,=lmA, 1,=2omA Ic=lmA vc,=5v 0.2 0.1 4 0.2 mA v Transfer charac terlstics Isolation resistance * Rlso DC500V 40 to 6O%RH v=o, f=lMHz vc,=2v Ic=2mA R,=lOO R 5XlO'O 10" - Q Floating capacitance Response time Response time (Rise) (Fall) cf tr tf 0.6 4 3 1.0 18 18 pF /IS ps SHflRP CORPORATION (Fig. 1) Forward ambient 50 2 CT. 4o 3 i2 2 e E E 30 current vs. temperature (Fig. 2) Diode power dissipation vs. ambient temperature 2o 10 0 -30 0 25 55 75 100 125 u -30 0 25 55 75 100 125 Ambient temperature Ta ("C) Ambient temperature Ta ( "C1 5 (Fig. 31 Collector power dissipation vs. ambient temperature (Fig. 4) Total power dissipation vs. ambient temperature 2ool+l+l+i 150 100 50 0 -30 0 25 50 75 100 125 3 g 3 g 8 F: & 8 & g ;ii 5 c- 200 170 150 100 50 01111111 -30 0 25 50 75 100 125 Ambient temperature Ta ( "C) Ambient temperature Ta ( `C1 2 (Fig. 5) Peak forward current vs. duty ratio Pulse widths100 Ta=25"C p!s Duty ratio SHARP CORPORATION ED-97123A MODEL No. 1 September 30, 199; PAGE PC3H7 4. Reliability The reliability of products items listed below. Test Items shall satis@ Confidence level : 90% LTPD: 10%/20% Failure `1 Solderability Soldering heat *2 *3 I 230%, I 260%, 5s 10 s v,>ux I,>UX2 EEO >UX2 Mechanical shock 15000m/s2, 0.5ms 3 times/ tX, tY, +Z direction 100 to 2000 to 1ooHz/4min 200m/s2 4 times/ X, Y, 2 direction 1 cycle -40 "C to + 125C (30mi.n) (30mir-i) 20 cycles test U High temp. and high humidity storage High temp. storage Low temp. storage Operation life +85%, 85%RH, 500h Ic 7/ 1 I Test Conditions Judgement Criteria I 1.2 n=ll, C=O I C=O I I n=ll, Terminal strength (Bending) *4 Weight : 1N 1 time/each terminal Variable vibration frequency Temperature cycling n=22 ,C=O Upper specification limit n=22 ,C=O I +125'C, I -40-C, lOOOh 1OOOh L : Lower specification limit n=22,C=O n=22,C=O n=22 ,C=O 1,=5OmA, Ptot= 170mW Ta=25"C, 1OOOh *1 Test method, conforms to JIS C 7021. *2 Solder shall adhere at the area of 95% or more of immersed portion of lead, and pin hole or other holes shall not be concentrated on one portion. *3 The lead pm depth dipped into solder shall be 0.2mm away from the root of lead pins. *4 Terminal bending d irection is shown below. 90' 3 Y90 Weight : IN 0.2mm or more SHARP CORPORATION MODEL No. PAG E PC3H7 8/11 5. Incoming inspection 5.1 Inspection items (1) Electrical characteristics V,, I,, I,, (2) Appearance , Vc,,st,, Ic, Riso, Viso 5.2 Sampling method and Inspection level A single sampling plan, normal inspection level II based on IS0 2859 is applied. The AQL according to the inspection items are shown below. Minor defect Appearance defect except the above mentioned. SHARP CORPORATION ED-97123A MODEL No. 1September 30, 1998 1 PAGE PC3H7 9/11 6.3 Package 6.3.1 specifications Taping conditions (11 Tape structure and Dimensions (Refer to the attached in which sheet, Page 10) on The tape shall have a structure the carrier tape. (2) Reel structure and Dimensions a cover tape is sealed heat-pressed (Refer to the attached its dimensions sheet, Page 11) The taping reel shall be of plastic with as shown in the attached drawing. (31 Direction of product insertion (Refer to the attached sheet, Page 11) at the Product direction in carrier hole side on the tape. (4) Joint of tape The cover tape and carrier tape shall direct to the anode mark tape in one reel shall be jointless. devices devices cut a bottom of carrier tape with a cutter, and the cut portion shall be sealed with adhesive tape. (5) The way to repair taped failure The way to repair taped failure after replacing to good devices, 6.3.2 Adhesiveness l of cover tape The exfoliation force between carrier tape and cover tape shall be 0.2N to 0.7N for the angle from 160' to 180' . method and quantity 6.3.3 Rolling l Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20cm of blank tape to the trailer and the leader of the tape and 6.x the both ends with adhesive tape. One reel shall contain 3OOOpcs. 6.3.4 Marking l The outer packaging * Number case shall be marked of pieces delivered with following information. date * Model No. 6.3.5 Storage l * Production condition Taped products shall be stored at the temperature 5 to 30C and the humidities lower than 7O%RH. during shipping or degradation of electrical 6.3.6 Safety protection l There shall be no deformation of component characteristics due to shipping. SHARP CORPORFITION ED-97123A MODEL No. 1 September 307 1998 PAGE PC3H7 lO/ll Carrier tape structure and Dimensions F_ E (_.-.-.Q&.-Q D /-T C -.-.-.-.& G -I- I i -.-.?#i&) .-.-.-.@ .-.-.-.-6 1/ A K . 5Omax to.3 null k-o.1 to.1 co.1 to.1 to. 1 12.0 5.5 1.75 8.0 2.0 4.0 K. +O.l -0.0 mm fO.1 f0.05 ko.1 to.1 L +O.l -0.0 + 1.5 7.5 0.3 2.3 3.1 p 1.6 SHARP CORPORATION ED-97123A MODEL No. 1 September 30, 199 PAGE PC3H7 ll/ll Reel structure and Dimensions a Check a mm 330 b 13.5t1.5 C word d e 23+1 f 2.0C0.5 g 2.0 kO.5 1OOt1 13t0.5 Direction of product insertion Pull-out direction SHARP CORPORATION ED-97123A MODEL No. 1September 30. 1998 PC3H7 I 1 PAGE Attach I Precautions for Photocouplers 1 For cleaning (1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less (2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PWB sire or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. (31 Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. 2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light emission power of the LED. (50%/5years) SHARP CORPORATION ED-97123A MODEL No. 1 September PC3H7 30. 1998 PAGE Attach sheet- l-2 3. Precautions for Soldering reflow : Photocouplers ( 11 If solder It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure below. 230C 25C Since, influence to the device is different according to reflow equipment and its condition, please use the device after confirming no damage in the actual using condition. (2 1 Other precautions An inii-ared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item (1). Also avoid immersing the resin part in the solder. |
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